IC chip marking inspection using FIR system

Wirat Khannakum; Kaset Sirisantisamrid

doi:10.1117/12.2573005

12 June 2020 IC chip marking inspection using FIR system

Wirat Khannakum, Kaset Sirisantisamrid

Proceedings Volume 11519, Twelfth International Conference on Digital Image Processing (ICDIP 2020); 115191R (2020) https://doi.org/10.1117/12.2573005
Event: Twelfth International Conference on Digital Image Processing, 2020, Osaka, Japan

Abstract

In this paper, we proposed a novel method for inspection the marking label of IC chip using FIR system. Firstly, the IC chip is loaded to the inspection machine and IC chip image are captured. Secondly, Maximum Stable Extremal Region (MSER) algorithm is applied to find the characters, numbers, and company logo regions of IC chip and crop the detected marking label region. Thirdly, convert the grayscale image to a binary image and segmented the characters, numbers and company logo using connected component labeling algorithm. We observed some IC chip is tilted when moving to marking inspection station and effect to the position of the characters, numbers and company logo are shifted. Thereby, we need to orientate them by using Normalization. Finally, the recognition system based on DCT and FIR system. The example of the correct extracting rate of IC marking inspection was 94%.

Citation Download Citation

Wirat Khannakum and Kaset Sirisantisamrid "IC chip marking inspection using FIR system", Proc. SPIE 11519, Twelfth International Conference on Digital Image Processing (ICDIP 2020), 115191R (12 June 2020); https://doi.org/10.1117/12.2573005

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