Presentation + Paper
24 April 2020 Modeling of a multi-month thermal IR study
Jay Clausen, Michael Musty, Anna Wagner, Susan Frankenstein, Jason Dorvee
Author Affiliations +
Abstract
Inconsistent and unacceptable probability of detection (PD) and false alarm rates (FAR) due to varying environmental conditions hamper buried object detection. A 4-month study evaluated the environmental parameters impacting standoff thermal infra-red (IR) detection of buried objects. Field observations were integrated into a model depicting the temporal and spatial thermal changes through a 1-week period utilizing a 15 minute time-step interval. The model illustrates the surface thermal observations obtained with a thermal IR camera contemporaneously with a 3-d presentation of subsurface soil temperatures obtained with 156 buried thermocouples. Precipitation events and subsequent soil moisture responses synchronized to the temperature data are also included in the model simulation. The simulation shows the temperature response of buried objects due to changes in incoming solar radiation, air/surface soil temperature changes, latent heat exchange between the objects and surrounding soil, and impacts due to precipitation/changes in soil moisture. Differences are noted between the thermal response of plastic and metal objects as well as depth of burial below the ground surface. Nearly identical environmental conditions on different days did not always elicit the same spatial thermal response.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jay Clausen, Michael Musty, Anna Wagner, Susan Frankenstein, and Jason Dorvee "Modeling of a multi-month thermal IR study", Proc. SPIE 11416, Chemical, Biological, Radiological, Nuclear, and Explosives (CBRNE) Sensing XXI, 1141605 (24 April 2020); https://doi.org/10.1117/12.2557398
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KEYWORDS
Metals

Thermography

Soil science

Visibility

Forward looking infrared

Sensors

Infrared imaging

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