Taking the multi-wavelength DBO to the next level of accuracy and robustness

Jinsun Kim; Jeongijn Lee; Chan Hwang; Seung Yoon Lee; Wooyoung Jung; Joonsoo Park; Kaustuve Bhattacharyya; Arie den Boef; Simon Mathijssen; Marc Noot; Farzad Farhadzadeh; Daniel Park; Kaustubh Padhye; Se-Ra Jeon; Seung-Bin Yang; Won-Jae Jang; Oh-Sung Kwon

doi:10.1117/12.2551676

20 March 2020 Taking the multi-wavelength DBO to the next level of accuracy and robustness

Jinsun Kim, Jeongijn Lee, Chan Hwang, Seung Yoon Lee, Wooyoung Jung, Joonsoo Park, Kaustuve Bhattacharyya, Arie den Boef, Simon Mathijssen, Marc Noot, Farzad Farhadzadeh, Daniel Park, Kaustubh Padhye, Se-Ra Jeon, Seung-Bin Yang, Won-Jae Jang, Oh-Sung Kwon

Author Affiliations +

Proceedings Volume 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV; 113251J (2020) https://doi.org/10.1117/12.2551676
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

In multi patterning processes, overlay is now entangled with CD including OPC and stochastics. This combined effect is a serious challenge for continued shrink and is driving down the allowed overlay margin to an unprecedented level. We need to do everything to improve overlay where accurate measurement and control of wafer deformation is extremely important. This requires accuracy in overlay metrology that decouples target asymmetry from wafer deformation. Multiwavelength diffraction-based overlay (DBO) is positioned for providing such accuracy while maintaining the required measurement speed. At the same time, with the increase of process complexity in advanced nodes, several new types of target asymmetries are introduced. Some of such asymmetries vary even within the target / grating area (intra-grating) and some are so severe that it impacts the center of gravity shift of the overlay target.

Conference Presentation

Citation Download Citation

Jinsun Kim, Jeongijn Lee, Chan Hwang, Seung Yoon Lee, Wooyoung Jung, Joonsoo Park, Kaustuve Bhattacharyya, Arie den Boef, Simon Mathijssen, Marc Noot, Farzad Farhadzadeh, Daniel Park, Kaustubh Padhye, Se-Ra Jeon, Seung-Bin Yang, Won-Jae Jang, and Oh-Sung Kwon "Taking the multi-wavelength DBO to the next level of accuracy and robustness", Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 113251J (20 March 2020); https://doi.org/10.1117/12.2551676

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