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10 March 2020 Two-Photon laser lithography for metrology and vice versa (Conference Presentation)
Julian Hering, Matthias Eifler, Xiukun Hu, Gaoliang Dai, Jörg Seewig, Georg von Freymann
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Proceedings Volume 11292, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XIII; 1129217 (2020) https://doi.org/10.1117/12.2543666
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Nowadays, no consensus concerning the definition of the resolution of 3D measuring and fabricating systems is available. In contrast, the lateral resolution for 2D is generally accepted as the minimum distance between two single points/features at which the imaging/manufacturing tool fails to resolve. To extend this approach at least to 2.5D systems, we present an appropriate approach based on the instrument transfer function. First, using a commercial DLW system, we introduce the respective basics of the concept for metrology. In a second step, we use this method to determine the 3D resolution capabilities of a STED-inspired high-speed fabrication system.
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Julian Hering, Matthias Eifler, Xiukun Hu, Gaoliang Dai, Jörg Seewig, and Georg von Freymann "Two-Photon laser lithography for metrology and vice versa (Conference Presentation)", Proc. SPIE 11292, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XIII, 1129217 (10 March 2020); https://doi.org/10.1117/12.2543666
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KEYWORDS
Lithography
Metrology
3D metrology
Laser metrology
Manufacturing
Optics manufacturing
3D modeling
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