Presentation
9 March 2020 Investigation of magnetic-field assisted laser ablation of silicon by using short and ultrashort laser pulses (Conference Presentation)
Author Affiliations +
Abstract
During the last decades laser micromachining became a valuable tool for many applications in automotive, medicine, tool construction, or mobile technology. Beside the quality, processing time and production costs are crucial questions. A promising approach to achieve high throughput combined with good processing quality represent laser ablation by an assisting magnetic-field. Therefore, we studied the influence of an applied magnetic field to the ablation behaviour of silicon by using short and ultrashort laser pulses. Based on the experimental results we report on a first theoretical model that addresses the energy distribution of the heated electrons in the irradiated area.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mareike Schäfer, Falicienne Gnintedem Keabou, Garik Torosyan, Yiyun Kang, Hicham Derouch, Baerbel Rethfeld, Johannes A. L'huillier, and Pavel Terekhin "Investigation of magnetic-field assisted laser ablation of silicon by using short and ultrashort laser pulses (Conference Presentation)", Proc. SPIE 11268, Laser-based Micro- and Nanoprocessing XIV, 112681I (9 March 2020); https://doi.org/10.1117/12.2546458
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KEYWORDS
Laser ablation

Silicon

Ultrafast phenomena

Semiconductor lasers

Magnetism

Electrons

Micromachining

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