Paper
1 March 2019 Large intermixing in the InGaP/InAlGaP laser structure using stress engineering at elevated temperature
Mohammed A. Majid, Ahmad A. Al-Jabr, Rami T. El Afandy, Hassan M. Oubei, Dalaver H. Anjum, Mohamed Shehata, Tien K. Ng, Boon S. Ooi
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Abstract
In this paper, a thermally induced dielectric strain on quantum well intermixing (QWI) technique is employed on tensilestrained InGaP/InAlGaP laser structure, to promote inter-diffusion, in conjunction with cycle annealing at elevated temperature. A bandgap blueshift as large as large as ~250meV was observed for samples capped with a single and bilayer of the dielectric film (1μm-SiO2 and 0.1μm-Si3N4) and annealed at a high temperature (700-1000oC) for cycles of annealing steps. Samples subjected to this novel QWI technique for short duration and multiple cycle annealing steps shown a high degree of intermixing while maintaining strong photoluminescence (PL) intensity, narrow full wave at half maximum (FWHM) and good surface morphology. Laser devices fabricated using this technique, lased at a wavelength of 608nm with two facet power of ~46mW, indicating the high quality of the material. Our results show that thermal stress can be controlled by the engineering dielectric strain opening new perspectives for QWI of photonics devices.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mohammed A. Majid, Ahmad A. Al-Jabr, Rami T. El Afandy, Hassan M. Oubei, Dalaver H. Anjum, Mohamed Shehata, Tien K. Ng, and Boon S. Ooi "Large intermixing in the InGaP/InAlGaP laser structure using stress engineering at elevated temperature", Proc. SPIE 10939, Novel In-Plane Semiconductor Lasers XVIII, 109390L (1 March 2019); https://doi.org/10.1117/12.2511878
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KEYWORDS
Annealing

Dielectrics

Silicon

Quantum wells

Gallium arsenide

Luminescence

Plasma enhanced chemical vapor deposition

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