CCD-based thermoreflectance imaging of high-power diode lasers with back-irradiance

Chen Li; Kevin P. Pipe; Chuanshun Cao; Prabhu Thiagarajan; Robert J. Deri; Paul O. Leisher

doi:10.1117/12.2302434

4 May 2018 CCD-based thermoreflectance imaging of high-power diode lasers with back-irradiance

Chen Li, Kevin P. Pipe, Chuanshun Cao, Prabhu Thiagarajan, Robert J. Deri, Paul O. Leisher

Proceedings Volume 10637, Laser Technology for Defense and Security XIV; 106370C (2018) https://doi.org/10.1117/12.2302434
Event: SPIE Defense + Security, 2018, Orlando, FL, United States

Abstract

The two-dimensional (2D) temperature profile of a high-power junction-down broad-area diode laser facet subject to back-irradiance (BI) is studied via CCD-based thermoreflectance (TR) imaging and finite element modeling. The temperature rise in the active region (ΔΤ_AR) is determined at different diode laser optical powers, back-irradiance reflectance levels, and back-irradiance spot locations. Interestingly, our study shows that ΔΤ_AR rises sharpest not when the back-irradiance is boresight-aligned with the active region but rather when it is centered in the absorbing substrate approximately 5 μm away from the active region, a distance roughly equal to half of the back-irradiance spot FWHM (9 μm). At this critical location, ΔΤ_AR is found to increase by nearly a factor of three compared to its increase without back-irradiance. This provides insight on an important location for back-irradiance that may be correlated with catastrophic optical damage (COD) for diode lasers fabricated on absorbing substrates, and also suggests a thermal basis for truncated lifetime and deegraded performance for diode lasers experiencing backirradiance.

Conference Presentation

Citation Download Citation

Chen Li, Kevin P. Pipe, Chuanshun Cao, Prabhu Thiagarajan, Robert J. Deri, and Paul O. Leisher "CCD-based thermoreflectance imaging of high-power diode lasers with back-irradiance", Proc. SPIE 10637, Laser Technology for Defense and Security XIV, 106370C (4 May 2018); https://doi.org/10.1117/12.2302434

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