Presentation + Paper
22 March 2018 7/5nm logic manufacturing capabilities and requirements of metrology
Author Affiliations +
Abstract
This paper will provide an update to previous works [2][4][9] to our view of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic technology for foundries. First, we will review of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. We will then update the industry’s progress towards addressing gating technical limits of the most important of these metrology solutions, highlighting key metrology technology gaps requiring industry attention and investment.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Benjamin Bunday, A. F. Bello, Eric Solecky, and Alok Vaid "7/5nm logic manufacturing capabilities and requirements of metrology", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105850I (22 March 2018); https://doi.org/10.1117/12.2296679
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CITATIONS
Cited by 9 scholarly publications.
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KEYWORDS
Metrology

Critical dimension metrology

Scanning electron microscopy

3D metrology

Silicon

X-rays

Overlay metrology

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