EUV local CDU healing performance and modeling capability towards 5nm node

Tae Kwon Jee; Vadim Timoshkov; Peter Choi; David Rio; Yu-Cheng Tsai; Hidetami Yaegashi; Kyohei Koike; Carlos Fonseca; Stijn Schoofs

doi:10.1117/12.2281627

16 October 2017 EUV local CDU healing performance and modeling capability towards 5nm node

Tae Kwon Jee, Vadim Timoshkov, Peter Choi, David Rio, Yu-Cheng Tsai, Hidetami Yaegashi, Kyohei Koike, Carlos Fonseca, Stijn Schoofs

Author Affiliations +

Proceedings Volume 10450, International Conference on Extreme Ultraviolet Lithography 2017; 1045017 (2017) https://doi.org/10.1117/12.2281627
Event: SPIE Photomask Technology and EUV Lithography, 2017, Monterey, California, United States

Abstract

Both local variability and optical proximity correction (OPC) errors are big contributors to the edge placement error (EPE) budget which is closely related to the device yield. The post-litho contact hole healing will be demonstrated to meet after-etch local variability specifications using a low dose, 30mJ/cm² dose-to-size, positive tone developed (PTD) resist with relevant throughput in high volume manufacturing (HVM). The total local variability of the node 5nm (N5) contact holes will be characterized in terms of local CD uniformity (LCDU), local placement error (LPE), and contact edge roughness (CER) using a statistical methodology. The CD healing process has complex etch proximity effects, so the OPC prediction accuracy is challenging to meet EPE requirements for the N5. Thus, the prediction accuracy of an after-etch model will be investigated and discussed using ASML Tachyon OPC model.

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Citation Download Citation

Tae Kwon Jee, Vadim Timoshkov, Peter Choi, David Rio, Yu-Cheng Tsai, Hidetami Yaegashi, Kyohei Koike, Carlos Fonseca, and Stijn Schoofs "EUV local CDU healing performance and modeling capability towards 5nm node", Proc. SPIE 10450, International Conference on Extreme Ultraviolet Lithography 2017, 1045017 (16 October 2017); https://doi.org/10.1117/12.2281627

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