Extreme-ultraviolet and electron beam lithography processing using water developable resist material

Satoshi Takei

doi:10.1117/12.2271024

31 August 2017 Extreme-ultraviolet and electron beam lithography processing using water developable resist material

Satoshi Takei

Proceedings Volume 10354, Nanoengineering: Fabrication, Properties, Optics, and Devices XIV; 1035414 (2017) https://doi.org/10.1117/12.2271024
Event: SPIE Nanoscience + Engineering, 2017, San Diego, California, United States

Abstract

In order to achieve the use of pure water in the developable process of extreme-ultraviolet and electron beam lithography, instead of conventionally used tetramethylammonium hydroxide and organic solvents, a water developable resist material was designed and developed. The water-developable resist material was derived from woody biomass with beta-linked disaccharide unit for environmental affair, safety, easiness of handling, and health of the working people. 80 nm dense line patterning images with exposure dose of 22 μC/cm² and CF₄ etching selectivity of 1.8 with hardmask layer were provided by specific process conditions. The approach of our water-developable resist material will be one of the most promising technologies ready to be investigated into production of medical device applications.

Citation Download Citation

Satoshi Takei "Extreme-ultraviolet and electron beam lithography processing using water developable resist material", Proc. SPIE 10354, Nanoengineering: Fabrication, Properties, Optics, and Devices XIV, 1035414 (31 August 2017); https://doi.org/10.1117/12.2271024

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