Paper
1 January 1994 Mask quality assurance from a user's perspective
Terry W. Russell
Author Affiliations +
Abstract
As the industry continues to move toward production in the 64- and 256-MB technology regime, the challenges posed by more stringent requirements associated with wafer lithography and reticle manufacturing are driving developments which may be out-pacing the ability of the industry to guarantee reticle performance.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Terry W. Russell "Mask quality assurance from a user's perspective", Proc. SPIE 10273, 64-to 256-Megabit Reticle Generation: Technology Requirements and Approaches: A Critical Review, 102730E (1 January 1994); https://doi.org/10.1117/12.177434
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KEYWORDS
Reticles

Lithography

Photomasks

Inspection

Semiconducting wafers

Manufacturing

Optical proximity correction

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