Presentation + Paper
27 March 2017 A track process for solvent annealing of high-χ BCPs
Author Affiliations +
Abstract
High chi organic lamellar-forming block copolymers were prepared with 18 nm intrinsic period Lo value. The BCPs were coated on a neutral layer on silicon substrates and were either thermally annealed or exposed to solvent vapors both in a 300mm track. The effect of lowering the glass transition temperature (Tg) on the high chi BCP was investigated. Process temperatures and times were varied. It was found that the BCP having lower Tg exhibits faster kinetics and is able to reach alignment in a shorter time than a similar BCP having higher Tg. Fingerprint defect analysis also shows that the BCP with lower Tg has lower defects. The results show that fingerprint formation can be achieved with either ether or ester type solvents depending on the BCP used. The results show that a track process for solvent annealing of high-χ BCPs is feasible and could provide the path forward for incorporation of BCP in future nodes. Finally, directed self-assembly was demonstrated by implemented high chi polymers on a graphoepitaxy test vehicles. CD and line width roughness was evaluated on patterns with a multiplication factor up to 7.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Douglas J. Guerrero, Kaumba Sakavuyi, Kui Xu, Ahmed Gharbi, Raluca Tiron, Isabelle Servin, Laurent Pain, Guillaume Claveau, Harold Stokes Jr., Masahiko Harumoto, Célia Nicolet, and Xavier Chevalier "A track process for solvent annealing of high-χ BCPs", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101460W (27 March 2017); https://doi.org/10.1117/12.2261094
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KEYWORDS
Annealing

Scanning electron microscopy

Directed self assembly

Semiconducting wafers

Polymers

Optical lithography

Line width roughness

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