Presentation + Paper
24 March 2017 Single-nm resolution approach by applying DDRP and DDRM
Wataru Shibayama, Shuhei Shigaki, Satoshi Takeda, Makoto Nakajima, Rikimaru Sakamoto
Author Affiliations +
Abstract
EUV lithography has been desired as the leading technology for 1x or single nm half-pitch patterning. However, the source power, masks and resist materials still have critical issues for mass production. Especially in resist materials, RLS trade-off has been the key issue. To overcome this issue, we are suggesting Dry Development Rinse Process (DDRP) and Materials (DDRM) as the pattern collapse mitigation approach. This DDRM can perform not only as pattern collapse free materials for fine pitch, but also as the etching hard mask against bottom layer (spin on carbon : SOC). In this paper, we especially propose new approaches to achieve high resolution around hp1X nm L/S and single nm line patterning. Especially, semi iso 8nm line was successfully achieved with good LWR (2.5nm) and around 3 times aspect ratio. This single nm patterning technique also helped to enhance sensitivity about 33%. On the other hand, pillar patterning thorough CH pattern by applying DDRP also showed high resolution below 20nm pillar CD with good LCDU and high sensitivity. This new DDRP technology can be the promising approach not only for hp1Xnm level patterning but also single nm patterning in N7/N5 and beyond.
Conference Presentation
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wataru Shibayama, Shuhei Shigaki, Satoshi Takeda, Makoto Nakajima, and Rikimaru Sakamoto "Single-nm resolution approach by applying DDRP and DDRM", Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101431H (24 March 2017); https://doi.org/10.1117/12.2258180
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Etching

Extreme ultraviolet

Optical lithography

Silicon

Extreme ultraviolet lithography

Line edge roughness

Line width roughness

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