Throughput scaling by spatial beam shaping and dynamic focusing

M. Kumkar; M. Kaiser; J. Kleiner; D. Flamm; D. Grossmann; K. Bergner; F. Zimmermann; S. Nolte

doi:10.1117/12.2256228

20 February 2017 Throughput scaling by spatial beam shaping and dynamic focusing

M. Kumkar, M. Kaiser, J. Kleiner, D. Flamm, D. Grossmann, K. Bergner, F. Zimmermann, S. Nolte

Proceedings Volume 10091, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII; 100910G (2017) https://doi.org/10.1117/12.2256228
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

With availability of high power ultra short pulsed lasers, one prerequisite towards throughput scaling demanded for industrial ultrafast laser processing was recently achieved. We will present different scaling approaches for ultrafast machining, including raster and vector based concepts. The main attention is on beam shaping for enlarged, tailored processed volume per pulse. Some aspects on vector based machining using beam shaping are discussed. With engraving of steel and full thickness modification of transparent materials, two different approaches for throughput scaling by confined interaction volume, avoiding detrimental heat accumulation, are exemplified. In Contrast, welding of transparent materials based on nonlinear absorption benefits from ultra short pulse processing in heat accumulation regime. Results on in-situ stress birefringence microscopy demonstrate the complex interplay of processing parameters on heat accumulation. With respect to process development, the potential of in-in-situ diagnostics, extended to high power ultrafast lasers and diagnostics allowing for multi-scale resolution in space and time is addressed.

Citation Download Citation

M. Kumkar, M. Kaiser, J. Kleiner, D. Flamm, D. Grossmann, K. Bergner, F. Zimmermann, and S. Nolte "Throughput scaling by spatial beam shaping and dynamic focusing", Proc. SPIE 10091, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXII, 100910G (20 February 2017); https://doi.org/10.1117/12.2256228

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available