Paper
18 April 1985 In-Line Automatic Photoresist Process Control
L. Lauchlan, K. Sautter, T. Batchelder, J. Irwin
Author Affiliations +
Abstract
Control of optically printed linewidths becomes increasingly difficult as diffraction effects degrade image quality. If, during development, the exposed film thickness is monitored by optical detection of interference fringes, it is possible to find the time at which the photoresist breaks through to the substrate. When this time is related to the total development time needed to print a given feature size, it is possible to automatical-ly adjust the total development time to correct for process drifts in dose, resist thickness or soft bake temperature. This paper will describe a method for in-line, automatic linewidth control for both spray and puddle development. This equipment can also be used in a process diagnostic mode to evaluate such photoresist parameters as the resist dissolution rate or initiation time before development actually begins. The implications of this tool for fully automated photoresist processing will be discussed.
© (1985) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
L. Lauchlan, K. Sautter, T. Batchelder, and J. Irwin "In-Line Automatic Photoresist Process Control", Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); https://doi.org/10.1117/12.947837
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CITATIONS
Cited by 7 scholarly publications.
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KEYWORDS
Photoresist developing

Semiconducting wafers

Photoresist materials

Process control

Calibration

Photoresist processing

Signal processing

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