Process Control By Automated In-Process Wafer Inspection

K L Harris; P Sandland; R M Singleton

doi:10.1117/12.941925

29 June 1984 Process Control By Automated In-Process Wafer Inspection

K L Harris, P Sandland, R M Singleton

Proceedings Volume 0470, Optical Microlithography III: Technology for the Next Decade; (1984) https://doi.org/10.1117/12.941925
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

This is the introduction of new technology developed specifically for the inprocess pattern inspection and measurement of very large scale integrated (VLSI) wafers. There is a current need for significant improvements in pattern inspection instrumentation in order to tighten process control and achieve more competitive yields and therefore die costs. For the tedious and detailed task of pattern inspection and measurement, automation is the indicated solution. The future of computerized manufacturing requires, most fundamentally, the automation of the instrumentation and control function. In this paper, a system, designated the KLA 2020 Wafer Inspector, is described which incorporates the basic functions required to measure variations in the patterning process: linear and area dimensional measurements, registration error measurement, comparison for defects down to submicron in size. It is capable of inspecting in-process wafers in order to gain the most immediate process feedback. The speed with which it does each of these tests, less than a second, allows significant increases in sample size and therefore statistical control. It is this technology which will make computer-controlled photo processing possible.

Citation Download Citation

K L Harris, P Sandland, and R M Singleton "Process Control By Automated In-Process Wafer Inspection", Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); https://doi.org/10.1117/12.941925

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KEYWORDS

Semiconducting wafers

Inspection

Wafer inspection

Optical lithography

Process control

Photomasks

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