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This PDF file contains the front matter associated with SPIE Proceedings Volume 6894, including the Title Page, Copyright information, Table of Contents, Introduction, and the Conference Committee listing
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Defect formation in wurtzite a-plane gallium nitride grown on r-plane sapphire has been studied using transmission
electron microscopy. The observed defect pattern grown along the [11-20] direction shows significant differences
compared to films grown along the [0001] direction. Predominant line defects identified in the a-plane GaN are Frank-Shockley partial dislocations bounding basal plane stacking faults and originating at the film/substrate interface. In order
to understand the impact of the anisotropic elastic properties of the wurtzite structure on the dislocation formation and
the stress around the dislocations anisotropic plane strain elasticity theory was applied and compared with results
obtained from isotropic theory calculations. Furthermore, dislocation properties were calculated for AlN and InN. It was
found that the line energy found for InN amounts only to about one third of the values obtained for GaN and AlN.
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The thick GaN layers were grown on GaN/Si(111) templates by hydride vapor phase epitaxy (HVPE). The GaN templates were grown by metal organic chemical vapor deposition (MOCVD), and there were remained some cracks on their layers. The silicon (Si) substrates were not treated any patterning process. The size of template was 2inch Si(111) wafer and these templates were directly used for HVPE growth. For the growth of the thick GaN layer, the gas injection system of HVPE was modified for improving its growth rate. The proper growth temperature and V/III ratio gave us a transparent thick GaN layer and its thickness has been over than 100um for 2 hours. After the growth, the Si substrate was etched by Si etching solution. We obtained a transparent thick GaN layer and its size was 1/4 inch as the biggest size and it was bended. Structural and optical properties of thick GaN layer were characterized by high resolution X-ray diffraction (HRXRD) and photoluminescence (PL) measurements.
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The growth of group-III nitride compound films using the Remote Plasma Chemical Vapour Deposition (RPCVD) process is investigated. The scalability of the technology to larger deposition areas will be discussed. In addition, the key advantages of the RPCVD process for GaN over more conventional deposition methods (such as MOCVD), which are realized through a lower growth temperature, compatibility with glass substrates, in addition to silicon and sapphire, and the complete elimination of toxic NH3 from the growth process will be presented. These advantages will be discussed via analysis of X-Ray diffraction, Scanning Electron Microscopy (SEM) and Optical Transmission Spectroscopy characterization methods of samples grown using the RPCVD process. In addition, subsequent downstream device processing of double heterojunction devices grown on glass and sapphire substrates will be discussed.
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The authors report on the growth of GaN on AlGaN/(111)Si micropillar array by metal-organic chemical vapor
deposition. Using the substrates with micropillar array, 2 μm-thick GaN films without cracks can be achieved.
Transmission electron microscopy, atomic force microscopy, and micro-Raman studies indicate that the dislocation
density and residual stress of the GaN grown on micropillar array are also reduced. The results reveal the potential of this
type of substrates for growing GaN-based devices as well as preparing GaN freestanding substrates.
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Due to lack of suitable lattice matched substrates, III-Nitride materials are usually grown on sapphire, SiC, and silicon. The heteroepitaxy of GaN on these substrates often incorporates a high density of dislocation and point defects due to lattice and thermal mismatch. It is desirable to reduce the defect density in III-Nitrides in order to fabricate longer lifetime and high brightness light emitting diodes, lasers, and high-electron mobility transistors. In this context, nano-scale epitaxy on patterned Si substrates allows lateral growth, which eventually leads to a reduction of defect density and strain in the overgrown GaN films. Large area nano-patterning with dielectric masks would also be useful to fabricate highly-ordered and dense nitride nanostructures by selective area homo- and hetero-epitaxy.
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Charge trapping resulting in localized band bending on MBE-grown GaN films was investigated using a new
combination of conducting atomic force microscopy (CAFM) and scanning Kelvin probe microscopy (SKPM). CAFM
was first used to locally inject charge at the surface oxide/semiconductor interface, and then SKPM was performed to
monitor the evolution of the resulting surface potential. In a dark environment, the additionally charged interface states
due to CAFM charge injection resulted in an induced additional band bending that persisted for hours. The induced band
bending is nominal (<0.5 eV) for CAFM voltages less than 8 V, and reaches a saturation value of ~3 eV for voltages
greater than 10 V. The saturation band bending corresponds to a total density of charged interface states (2×1012 cm-2)
that is double the value observed for the intrinsic surface. Induced band bending could still be observed up to 4 h after
charge injection, indicating that charge trapping is relatively stable in a dark environment. However, charged interface
states could be rapidly neutralized by illumination with UV light. A phenomenological model based on a tunneling
mechanism was used to successfully describe the CAFM charge injection, where electrons travel from the tip through an
oxide barrier and become trapped at oxide/GaN interface states. Saturation occurs due to the existence of a finite density
of chargeable states at the interface. After charge injection, the decrease in induced band bending with time was found to
be consistent with a thermionic model of charge transfer from the interface to the bulk.
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We have investigated bulk GaN material grown by HVPE either in the conventional polar [0001] direction and
subsequently sliced with nonpolar surfaces or grown in the nonpolar [11-20] direction. Spatially resolved techniques
such as cathodoluminescence imaging and transmission electron microscopy, as well as profile measuring techniques
such as positron annihilation spectroscopy and secondary ion mass spectroscopy were employed to directly visualize the
extended structural defects, and point defect (impurity and vacancy) distributions along the growth axes. A comparative
analysis of the results shows a distinctive difference in the distribution of all kind of defects along the growth axes. A
significant decrease in the defect density in material grown along the polar direction, in contrast to the constant behavior
of the high defect density in material grown along the nonpolar direction points out the low-defect superior quality of the
former material and indicates the preferable way of producing high-quality GaN substrates with nonpolar surfaces.
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We report on the emission properties of GaN/AlN superlattices (SLs) grown by metalorganic chemical vapor deposition on a thick GaN layer. Nominally undoped and Si-doped SL structures with the well/barrier thickness ratio 3:1 and different SL periods are investigated. It is found that in these SLs without capping layer the energy position, intensity and linewidth of the emission are determined by the interplay of the built-in polarization field, the depletion field arising from the pinning of the Fermi level at the surface, and the screening of the electric field in the quantum well due to the both the polarization-induced two-dimension electron gas (2DEG) and the photo-generated carriers. A non-uniform equilibrium electron distribution and an electron accumulation at the bottom AlN/GaN interface are evidenced by the observed recombination of the 2DEG with the photo-excited holes occurring below the GaN bandgap.
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We report our experimental and theoretical studies on the time-resolved dynamics of conduction electrons and coherent
acoustic phonons (CAPs) in high quality GaN single crystals. Our measurements were performed using a two-color
(ultraviolet and near-infrared), femtosecond, pump-probe spectroscopy by scanning the transient differential reflectivity
(ΔR/R) signal of the probe beam. We have found that the threshold for the intervalley transition of electrons between the
conduction band Γ and L valleys appears at the energy of 4.51 eV at 300 K and it increases to 4.57 eV at 100 K. We
have also numerically simulated intervalley scattering dynamics and found that the characteristic scattering time
constants were temperature independent and fitted extremely well our experimental data. The electron scattering time
from the Γ to L valley was limited by the 150-fs width of our pump pulses, while the return process of electrons from L
to Γ was characterized by the scattering time of 1 ps, and the total depopulation time of the L valley was ~20 ps. On the
exponentially decaying part of the ΔR/R transient, we have observed pronounced CAP oscillations with the intrinsic
lifetime of at least 100 ns. The CAP amplitude was only dependent on the pump photon energy, while the oscillation
frequency was dispersionless (proportional to the probe-beam wave vector) with the slope (velocity of the acoustic
phonon propagation) determined by the speed of sound in GaN. The CAP characteristics agreed well with a developed
theoretical model.
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Transition metal (TM) doped diluted magnetic semiconductors (DMSs) have many unique physical properties that can
be used for magneto-optical and spintronic applications. The DMSs exhibit a wide range of magnetic ordering behavior.
For example, Mn doped GaN can be either ferromagnetic or antiferromagnetic, depending on the Mn concentration,
carrier density, or pressure. A unified band coupling model based on the p-d and d-d level repulsions between the TM
and host elements are developed to explain the hole-induced ferromagnetism. We show that kinetic s-d coupling can be
introduced through chemical ordering and strain, thus leading to electron-mediated ferromagnetism. Moreover, by using
rare-earth elements (e.g., Gd) as magnetic dopants, the symmetry-allowed s-f coupling can also lead to a large splitting
at the conduction band edge, producing electron-mediated ferromagnetism. Our model, therefore, provides a simple
guideline for future band structure engineering of magnetic semiconductors.
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Spin-orbit coupling is investigated by magnetoconductivity measurements in wurtzite AlxGa1-xN/AlN/GaN
heterostructures with a polarization induced two-dimensional electron gas with different Al concentrations ranging from
x = 0.1 to 0.35. By employing the persistent photoconductivity effect and by gating we are able to vary the carrier
density of the samples in a controllable manner from 0.8
×1012 cm-2 to 10.6 ×1012 cm-2. The samples are characterized
using magnetoresistance measurements. To characterize the spin-orbit interaction we measured quantum corrections to
conductance at low magnetic fields. All the samples we studied exhibit a weak antilocalization feature at liquid He
temperatures. The zero-field electron spin-splitting energies extracted from the weak antilocalization measurements are
found to scale with the Fermi wavevector kF as 2( ακF + γκF3) with effective linear and cubic spin-orbit parameters of
-α= 5.01×10−13 eV • m and γ= 1.6 ×10−31 eV •m3, respectively. The linear spin-orbit coupling arises from both the bulk
inversion asymmetry of the crystal and the structural inversion asymmetry of the heterostructure whereas the cubic spinorbit
coupling parameter is purely due to the bulk inversion asymmetry of the wurtzite crystal. We also extracted phase
coherence times from the amplitude of the weak antilocalization feature. The measured phase coherence times ranged
from 3-40 ps and were in agreement with the theory of decoherence based on electron-electron interactions.
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In order to elongate lifetime of high power pure-blue GaN based laser diodes, reduction of newly created structural
defects at active region, which consists of multiple quantum well structures, is inevitable. We, first, report on detailed
structural analysis of this new type defects and discuss formation mechanism and reduction methodology of these
defects. We, then, fabricated laser diodes with current injection-free structure at front facets, which is confirmed to be
effective for suppression of degradation by catastrophic optical damage. We also discuss degradation mechanism of the
laser diodes.
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We investigated the degradation modes in the aging processes of TO-18 packaged (Al, In)GaN laser diodes
grown by metal organic chemical vapor deposition (MOCVD) on low-dislocation-density bulk GaN wafers. The
lifetime-limiting degradation drastically occurred in the initial stage, and we found it was due to the photon-enhanced
carbon deposition on the oxide mirror surface at the laser-emitting facets. The deposited carbon would be originated
mostly from residual organic materials with C-H bonds. The carbon sources could be successfully removed by plasma
cleaning just before cap-welding. The improved lifetime of the plasma cleaned laser diode packed with argon gas
exceeds 2,000 h under 160 mW cw-operation at 60 °C. The lifetime-limiting degradation is attributed to nonradiative
recombination related with the defects extended from GaN substrates. The activation energy of the degradation extracted
from the thermally accelerated aging tests was determined to be 0.81 eV.
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We report temperature tuning of pulsed operated InGaN LDs (5×500μm stripe,
grown on low-dislocation, high-pressure grown GaN substrates). The devices
are characterized by a rather weak temperature dependence of the threshold
current. A very broad temperature tuning range of 16nm was obtained with
increase of operation temperature by almost 200K. We were able to tune the
diode from the initial wavelength of 415nm at room temperature up to 431nm
at 201°C. After thermally cycling the device no substantial degradation was
noticed. We observed multimode emission and mode hopping with temperature
increase. At 201°C the laser's threshold current doubled and the slope efficiency
of the L-I curve dropped by 35%. These results demonstrate the potential
usage of temperature tuning of nitride-based-LDs for the atomic spectroscopy-related applications.
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In this paper we present reliability study of violet, InGaN based laser diodes
grown on low dislocation density bulk GaN crystals. We observe two main
phenomena responsible for degradation in our laser diodes. One of them is the
increase of nonradiative recombination in quantum wells which is visible on
cathodoluminescence images. The second mechanisms is connected to the
increase of leakage current seems to be responsible for the observed evolution
of the characteristic temperature of laser diodes.
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We report on the fabrication and characterization of GaN/AlN based superlattice structures with intersubband transition
wavelengths in the optical telecom range. The devices consist typically of 40 periods of 1.5 nm thick Si-doped GaN
wells and up to 15 nm thick AlN barriers. The photovoltaic mode of operation has allowed us to test these detectors at
room temperature and for frequencies ranging into the multiple GHz region. Substantial performance improvements are
expected if proper high frequency mounting and processing techniques will be used in the future.
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Bluish-green semipolar GaInN/GaN light emitting diodes (LEDs) were investigated as possible candidates for
high-brightness devices even in the long wavelength visible regime. To combine the high material quality known
from c-GaN and the advantages of a reduced piezoelectric field, the LED structures were realized on the {1¯101} side facets of selectively grown GaN stripes with triangular cross section. Structural investigations using transmission
electron microscopy, scanning electron microscopy, high resolution x-ray diffraction, and atomic force
microscopy have been performed and could be related to the luminescence properties in photoluminescence and
cathodoluminescence. The defect-related luminescence peaks at 3.3 eV and 3.42 eV typically observed in planar
non- and semipolar GaN structures as fingerprints of prismatic and basal plane stacking faults, respectively,
could be eliminated in our facet LED structures by optimized growth conditions.
Furthermore, an indium incorporation efficiency for these {1¯101} facets is found to be about 50% higher
as compared to c-plane growth, what helps significantly to achieve longer wavelength emission in spite of the
reduced quantum confined Stark effect in such non- and semipolar materials.
Combining these findings, we could realize a bluish-green semipolar light emitting diode on the side facets of
our GaN stripes. Continuous wave on-wafer optical output powers as high as 240 µW@20mA could be achieved
for about 500nm emission wavelength in electroluminescence measurements. The external efficiency was nearly
constant for the investigated current range. Furthermore, the relatively small wavelength shift of about 3 nm for
currents between 10mA and 100mA confirmed the reduced piezoelectric field in our LED structures.
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To improve the LED (Light Emitting Diode) efficacy is the major consideration when the backlight and lighting
system are implemented. An important source of poor efficacy come from the chip process or heat dissipation. White
LED used blue chip with phosphor is the current solution and inadequate for the tunable color temperature system.
The use of RGB (Red, Green and Blue) LED with smart control is presented in this study. The resulting coupled
optical and thermal shows the better performance when it is synthesized in conjunction with a degree of color mixing
technology.
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GaN vertical LED on metal alloy substrate (VLEDMS) is a desirable technology suitable for solid state lighting
application from the viewpoint of reliability and lighting efficacy performance. A new top surface engineering technique
for efficient light extraction is employed to VLEDMS to improve power conversion efficiency further. Corrugated
pyramid shaped (CPS) surfaces are developed and formed on VLEDMS. By using such structure, VLEDMS exhibit a
great enhancement of around 20% in light output power, and a high efficiency of over 100 lumens per watt can also be
achieved by white LEDs. In the life test, the light output power of VLEDMS chips drop only by less than 10% within
3,000 hours, and the chips can also endure over 1000 cycles of thermal shocks without significant variations in electro-optical
performance. Therefore, the highly reliable and bright VLEDMS using CPS surface engineering technique is very
suitable for the solid-state lighting application.
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The recent breakthrough in high power GaN LED's efficiency makes the adoption of these tiny solid state light
emitting devices into general lighting application earlier than expected before. However, heat management is still an
important issue for these white high power GaN LEDs. So far, the most popular driving current for 1mm square die is
about 350mA but there is a trend to increase the driving current up to 1A or even higher. In order not to degrade the LED
performance at such a high current operation, it is very important to reduce the thermal resistance and keep the junction
temperature below 60 degree centigrade.
In the past, GaN flip chip, thin GaN LED, or GaN on SiC or GaN substrate are some typical structures used to
make high power LEDs with low thermal resistance. However, all of these methods need very complicated chip process
or using very expensive substrates and are difficult to meet general lighting dollar per lumen target. In this study, we
proposed a cheaper way to make a high power LED die with lower thermal resistance. We will report how we can
achieve the thermal resistance of high power GaN LED die less than 1°C/W.
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High ESD endurance capability is an important issue for the extensive application of power light emitting
diodes (LEDs). Conventional ceramic varistor based on sintered bulk zinc oxide (ZnO) with various metal oxides as
additives have widely used in surge protection device by grounding the excessive current for a long time. Those sintered
bulk ZnO devices are known to exhibit high nonlinearity coefficient (α>50) and good reliability for many commercial
applications. However, sintering manufacture method limits the practicability of integrating bulk ZnO varistor with other
semiconductor devices. In this research, we report on the thin-film ZnO produced by sputtering system and post-heat
treatment which have shown good varistor characteristics. The nonlinear coefficients (α) in the correspondent current
-voltage (I-V) curve can up to 50 at a high electric field of 1.1 kV/cm, and, with efficiently resolving thermal generated
by high injected current, this thin film varistor can conduct current to the density as high as 20A/cm2 successfully. In
addition, our thin film varistor devices combined with power LEDs by gold wires bonding revealed an improved
electrostatic discharge (ESD) ability of up to 400V apparently. This wire bonding configuration will be modified to a
flip-chip LED with the ZnO/Si submount in the future. Sputtering and annealing are two commonly used processes in
general semiconductor manufacture procedures which are adopted in our ZnO thin film deposition. Therefore, our
proposed method have provided a new possible solution to integrate not only LEDs but also other semiconductor devices
with thin film varistor owning surge protection capability, especially to accomplish an on-chip surge protection.
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We fabricated two types of high luminous efficiency white light emitting diodes (LEDs). The first one is the white
LED, which had a high luminous efficiency (ηL) of 161 Lm/W with the high luminous flux (φv) of 9.89 Lm at a forward-
current of 20 mA. Used blue LED had a high output power (φe) of 42.2 mW and high external quantum efficiency (ηex)
of 75.5%. The second one is the luminous-efficiency-maximized white-LED with a low forward-bias voltage (Vf) of
2.80 V, which is almost equal to the theoretical limit. ηL and wall-plug efficiency (WPE) were 169 Lm/W and 50.8%,
respectively, at 20 mA. They were approximately twice higher than those of a tri-phosphor fluorescent lamp (90 Lm/W
and 25%). Moreover, we succeeded in fabricating longer wavelength laser diodes (LDs) with an emission wavelength of
488 nm under CW current condition by optimizing the growth conditions and structure of LDs. To our knowledge, this
wavelength is the longest for under CW current condition in GaN-based LDs.
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Red, green and blue semiconductor lasers are of great interest for full color laser projection. Mobile applications require
low power consumption and very small laser devices. InGaN lasers are the best choice for the blue color in applications
with output power requirements below 100mW: (1) they have much higher wall plug efficiencies than conventional blue
frequency doubled diode pumped solid state lasers and (2) they are more compact than semiconductor IR lasers with
subsequent second harmonic generation.
We present blue InGaN lasers with high efficiency at a power consumption of several 100mW. Excellent epitaxial
quality permits low internal losses. Threshold current densities and slope efficiencies are further optimized by improving
the facet coating. The laser threshold current is as low as 25mA and the slope efficiency reaches 1W/A. We present a
wall plug efficiency of 15% at output power levels of 60mW.
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Cross-sectional potential distribution of AlGaN/GaN HFETs with and without surface passivation by silicon
nitride (SiNx) has been investigated by using Kelvin probe force microscopy to study the effect of the surface
passivation layer on an electric field under high operating bias conditions. The measured FETs exhibited DC
characteristics of the maximum drain current of 750 mA/mm, threshold voltage of -5 V, and the transconductance
of 150 mS/mm. For the bias condition of the gate voltage of -5 V and the drain voltage of 40 V, the electric field
is mainly concentrated at three areas without relation to the presence or absence of the surface passivation layer.
One is the mid-point between the gate and drain electrodes at FET surface. The others are the mid-depth of
GaN buffer layer under the drain electrode and the interface between GaN buffer and SiC substrates from drain
edge toward source electrode. Near the surface of SiNx-passivated AlGaN/GaN HFETs, it is confirmed that the
intensity of electric field concentration decreases compared to that of no-passivated AlGaN/GaN HFETs. It is
considered that this result originates in the decrease of the surface charge by SiNx passivation. In addition, It is
found that the electric field concentration near the GaN/SiC interface has a tendency to become stronger rather
than that between the drain and gate electrodes by SiNx passivation.
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We review the physics of deep UV LEDs with emphasis on the features that differ from those for visible LEDs. We
discuss UV designs, novel growth process of light generating structures (MEMOCVDTM) that allows for reducing the
growth temperature and improving materials quality, and "phonon engineering" approach that takes advantage of high
polar optical energy in AlN/GaN/InN materials for confining electrons in the light emitting quantum wells. We then
review the characteristics of DUV LEDs grown on sapphire substrates with peak emission wavelength from 250 to 340
nm that demonstrate the lowest optical noise among all other UV light sources and, therefore, are well suited for the
detection of hazardous biological agents using fluorescence techniques. Finally, we describe high power multi-chip,
multi-wavelength deep UV light sources and review emerging applications of deep UV LED technology.
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The co-sputtering Al-doped ZnO (AZO) films with Al nano-particles were used to increase the extraction efficiency of
GaN-based light-emitting diodes (LEDs). Fixing the ZnO radio frequency (RF) power of 100W and changing the Al DC
power from 0 to 13W, the AZO films with various Al contents can be obtained. In the experimental results, the AZO
films deposited with Al DC power of 0, 4.5 and 7W do not have Al segregation. However, the segregated Al
nano-particles can be found in the AZO films deposited by Al DC power of 10W and 13W. The co-sputtering 170
nm-thick AZO films with and without Al nano-particles were deposited on the transparent area of LEDs and compared
the light output intensity of conventional LEDs. The light intensity of LEDs with AZO films with Al DC power 0, 4.5
and 7W increased 10% than that of conventional LEDs. This was due to the AZO film played a role of anti-reflection
coating (ARC) layer. The light intensity of LEDs with AZO film deposited using Al DC power of 10W and 13W
increased about 35% and 30%, respectively. It can be deduced that the output light is scattered by the Al nano-particles
existed in the AZO film.
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High-efficiency "true" green light-emitting diodes (LEDs) (λ~550nm) are one of the key elements in realizing high-brightness
RGB-based white-lighting systems. Because the InGaN multiple quantum wells (MQWs) in the active
regions of green LEDs contain a high indium alloy composition and a corresponding large lattice mismatch, the QW has
a reduced material quality and contains large piezoelectric fields induced by the large strain. The piezoelectric field
reduces the overlap of the electron-hole wave functions, and so results in reduced internal quantum efficiency in green
LEDs. In addition, other effects can strongly impact InGaN materials with high indium content, e.g., detrimental
annealing of the MQW active region during the subsequent growth of the p-type hole injection and contact layers. In
this study, the optical and structural characteristics of green LEDs employing p-InGaN and p-InGaN/p-GaN superlattices
(SLs) were examined. For the LEDs with a p-In0.04Ga0.96N:Mg layer grown at 840°C, only a slight decrease in PL
intensity was observed compared to similar structures grown without a p-layer. However, pits are observed for p-
In0.04Ga0.96N:Mg layers, which may cause increased reverse current leakage. In order to decrease the reverse leakage
current, p-InxGa1-xN/p-GaN SLs were developed. The hole concentration of the p-InxGa1-xN/p-GaN SLs is close to that
of p-In0.04Ga0.96N, and is much higher than that of p-GaN grown at an acceptably low temperature. In addition, pits
disappear in optimized p-InxGa1-xN/p-GaN SLs. In order to study the structural and optical characteristics of green LEDs
with p-In0.04Ga0.96N and p-InxGa1-xN/p-GaN SL layers, I-V characterization and electroluminescence measurements were
performed and the results will be described in detail.
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The p-side-up GaN light-emitting diode (LED) were fabricated using a combination of omni-directional reflector (ODR)
and double-sided textured surface (both p-GaN and undoped-GaN) techniques. An Essential Macleod program was used
to simulate the optimum thickness of the ODR structure. The reflectivity value of ODR structure used in work can reach
99%. On the top-side textured surface, the p-type GaN with hexagonal cavities was grown under low temperature
conditions using metalorganic chemical vapor deposition. The GaN LED with a suitable low-temperature p-GaN cap
layer thickness was also studied. Experimental results indicate that the LED sample with a 200-nm hexagonal cavity
GaN layer on the surface exhibits a 50% enhancement in luminance intensity. For a small chip size of 250 μm×500 μm,
the luminance efficiency can be improved from 23.2 to 28.2% at 20 mA. However, the luminance efficiency with a
larger chip size of 1mm×1mm can be improved from 19.8 to 28.9%. This indicates that the thin-film structure can
enhance the light extraction efficiency of GaN-based LEDs, especially for the large chip sizes.
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We developed GaN photocathodes for detecting ultraviolet radiation by using Mg-doped GaN. Crack-free, 200
nm thick GaN:Mg layers were grown by metal organic chemical vapor phase epitaxy (MOVPE) on a GaN template
having a structure of undoped GaN/(AlN/GaN) multilayers on Si (111) substrate. The Mg concentration was varied in
the range from 7×1018 to 7×1019 cm-3. The grown film was mounted in a phototube to operate in reflection mode; i.e. the
light was incident from the photoemission side. The photoemission surface was activated by sequential adsorption of
cesium and oxygen to reduce electron affinity, ensuring efficient electron emission. Photoemission spectrum was
measured in the range of 200-600 nm. We found that the quantum efficiency of photoemission was affected by the
crystallinity of GaN:Mg, depending on the concentration of Mg dopant and the growth pressure of GaN:Mg top
photoemissive layer. The lower Mg concentration and higher growth pressure resulted in higher quantum efficiency. The
obtained maximum quantum efficiency was 45% at 200 nm (6.2 eV) and 25% at 350 nm (3.54 eV). The elimination ratio
between visible and UV light was 4 decades and the slope of cutoff was 10 nm per decade.
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Spintronics is a new direction in nitride electronics, due to the development of rare-earth-doped
nitrides with ferromagnetic properties even at room temperature. This allows manipulation of
both the spin and the charge transported by the electrons. It allows the extension of Moore's law.
However, the injected spin-polarized current is subject to spin-flip due to various causes. The rate of
each of these spin-flip currents is affected by quantum 1/f noise, because of the low-frequency
photon emission amplitude that is associated with the elementary spin flip process, no matter what
causes the spin flip. As a result, in a spin valve, both the leakage current and the allowed current
will show 1/f noise. In devices with injection and subsequent control of spin-polarized electrons, the
effects obtained will also show this spintronic quantum 1/f noise. For instance, the light output of a
spin-controlled LED will exhibit quantum 1/f intensity fluctuations. The present paper calculates the
1/f noise expected in spintronic currents and in rare-earth-doped nitride devices and systems that
carry them. The spectral density of this fundamental 1/f noise is inherently proportional to the
square of the current that is affected by it, but is also inversely proportional to the number of carriers
defining this current. The latter dependence causes the spectrum to be proportional to the first power
of the current.
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High voltage HFET's fabricated from nitride semiconductors utilizing the AlGaN/GaN heterojunction or
GaAs using field plates demonstrate excellent RF output power performance. The nitride HFET's produce
RF output power greater than an order of magnitude higher than available from GaAs and InP based
devices, and GaAs FET's fabricated with field-plates can produce RF output power about a factor of two
greater than standard FET's. However, the FET's demonstrate a reliability problem where the dc current
and RF output power continually decrease as a function of time. The problem is more serious in the nitride
HFET's, although both nitride-based and GaAs-based devices suffer reliability problems. The reliability
problem is related to the conduction characteristics of the gate electrode and an electron tunneling
mechanism where electrons leak from the gate to the surface of the semiconductor. In this work the physics
responsible for this behavior are investigated and described. Physics-based models suitable for use in RF
circuit harmonic-balance simulators have been developed, with excellent agreement between measured and
simulated data. Design techniques to reduce the reliability problem will be discussed.
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With the DARPA Wide Bandgap Semiconductor Technology RF Thrust Contract, TriQuint Semiconductor and its partners,
BAE Systems, Lockheed Martin, IQE-RF, II-VI, Nitronex, M.I.T., and R.P.I. are achieving great progress towards the
overall goal of making Gallium Nitride a revolutionary RF technology ready to be inserted in defense and commercial
applications. Performance and reliability are two critical components of success (along with cost and manufacturability). In
this paper we will discuss these two aspects. Our emphasis is now operation at 40 V bias voltage (we had been working at
28 V). 1250 µm devices have power densities in the 6 to 9 W/mm with associated efficiencies in the low- to mid 60 % and
associated gain in the 12 to 12.5 dB at 10 GHz. We are using a dual field-plate structure to optimize these performances.
Very good performances have also been achieved at 18 GHz with 400 µm devices. Excellent progress has been made in
reliability. Our preliminary DC and RF reliability tests at 40 V indicate a MTTF of 1E6hrs with1.3 eV activation energy at
150 0C channel temperature. Jesus Del Alamo at MIT has greatly refined our initial findings leading to a strain related
theory of degradation that is driven by electric fields. Degradation can occur on the drain edge of the gate due to excessive
strain given by inverse piezoelectric effect.
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Objective of this paper is to evaluate the performance of GaN HEMTs for high temperature applications. A sample
AlGaN/GaN HEMT structure is investigated using empirical data to evaluate the device performance at high
temperatures. Input transfer and output characteristics are the key focus along with transconductance and saturation
current. Intrinsic device parameters were calculated using measured S-parameter data at various frequencies under
different bias conditions and temperatures. Transconductance found at 398 °K is 2.5 mS for the entire gate width. DC
characteristics of the fabricated devices were examined at temperatures ranging from 295 °K to 363 °K. Maximum drain
current measured at room temperature was 214 mA which reduced to 192 mA at 363 °K. Reduction in saturation drain
current is found due to decrease in saturation carrier velocity and two dimensional electron density. Structure based
simulation tool ATLAS from Silvaco Int. is used for numerical simulations. The simulated device performance is in
good agreement with the empirical results. Experimental results for the critical parameters suggest that the device can
operate in the GHz Range for temperature up to 600 °K. Further enhancement of the model device is suggested upon
reviewing the measured results to improve the high-temperature performance.
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To utilize the great potential of nitride compound semiconductors and improve their characteristics for a variety of high
power applications, physical theories describing the device performance and reliability are needed. In this vein we
provide noise-based reliability indicators through the quantum theory of 1/f noise. We develop new physical theories of
FET and HFET failure based on the new concept of "heat instability." This allows suggesting stability criteria and new
approaches to increase the reliability of HFETs. The quantum 1/f noise formulas have been recently refined for the case
of AlGaN/GaN HFETs, of other heterostructures and FETs through a better definition of the coherence parameter s,
exhibiting much better agreement with the experiment. This allows for the first time to verify the reliability of a device
by comparing the measured 1/f noise with its calculated value.
Furthermore, quantum theory based studies of the noise behavior of FETs and HFETs under the influence of ionizing
radiation induced damage, allow development of measures for radiation hardening. They also clarify the failure
mechanisms and suggest ways to reliability optimization for rf stress. Results reported for the first time in this paper
show that under certain conditions, limited doses of radiation may improve HFETs and reduce their channel 1/f noise.
This happens by reduction of (large angle) lattice scattering in favor of (small angle) defect and impurity scattering. The
theory also predicts that the noise of p-n junction-based devices will always increase. Finally, the new quantum 1/f noise
methods developed here are applied to compound semiconductor MQW infrared and THz photodetector heterostructures.
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This paper describes device process and characteristics of sub-100-nm-gate AlGaN/GaN heterostructure field-effect transistors (HFETs) for millimeter-wave applications. We developed three techniques to suppress short-channel effects and thereby enhance high-frequency device characteristics: high-AL-composition and thing AlGaN barrier layers, SiN passivation by catalytic chemical vapor deposition, and sub-100-nm Ti-based gates. The Al0.4Ga0.6N(6 nm)/GaN HFETs with a gate length of 60 nm on a 4H-SiC substrate showed a maximum drain current density of 1.6 A/mm and a maximum transconductance of 424 mS/mm. THe use of the techniques led to record current-gain cutoff frequency (fT) and maximum oscillation frequency (fmax) of 190 and 241 GH, respectively. The fT and fmaxkept high values over the wide range of drain voltage and current. These results indicate significantly high potential of GaN HFETs for high-power applications in the millimeter-wave frequency range.
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This report will focus on the status of GaN HEMT based amplifier technology development at RFMD. This technology
is based around GaN on semi-insulating SiC substrates for optimal thermal performance. RFMD's 0.5μm gate
technology features high performance advanced field plate structures, including a unit power cell producing high gain
(21dB), high power density (3-5W/mm at 28V) and high efficiency (65-70 percent) at cellular frequencies. We will
report on transistor and module performance relevant to applications ranging from high power, high bandwidth
amplifiers, to switches and ICs for radar, electronic warfare, cellular infrastructure and homeland security. Additionally,
we will report on reliability results that demonstrate capability for dependable, high voltage operation.
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There are as many types of quantum 1/f noise [1], [2], as there are systems of massless infraquanta with
infrared-divergent coupling to the current carriers. Each of these types has a conventional and coherent part,
corresponding to terms in the hamiltonian that are proportional with the first and second power of the number of carriers
defining the current, respectively. In piezoelectric materials, particularly those also showing ferroelectric spontaneous
polarization, transversal phonons are the massless quanta leading to piezoelectric, or lattice-dynamic, quantum 1/f
effects, again both conventional and coherent. As in the usual QED case, the observable 1/f noise is approximated by a
weighted sum of the conventional and coherent quantum 1/f effects. The sum involves the coherence parameter, this
time denoted by s', in the weight factors. The parameter s' is also estimated from first principles. The general formula
involving s' is applied to bulk GaN and AlGaN grown with different methods, and includes the dependence on stress and
polarization. It also includes the dependence on stress and the geometry of the sample. It is important both for reliability
testing and for general device optimization.
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We report a current status of high-power GaN HEMTs for high-power and high-efficiency amplifiers with higher
efficiency by 5% especially at a backed-off region than the conventional GaN HEMTs. First, we introduce our specific
device structure GaN HEMT with dispersion-free I-V characteristics, low Idsq-drift and high reliability. Record average
drain efficiency of over 50% and linear gain of 17.2 dB were obtained at an output power of 45 dBm and 2.5 GHz. Next,
we discuss their reliability with high-temperature life tests resulting in their estimated life of over 1 x 106 hours at Tj of
200 °C. High-k insulated gate HEMTs using Ta2O5 were also developed. Finally, we describe the next generation GaN
HEMTs for millimeter-wave applications.
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In AlGaN/GaN heterostructure field effect transistors (HFETs), two-dimensional-electron-gas (2DEG), induced by
strong piezoelectric and spontaneous polarization field, has high sheet density, and can be tuned up to 5 ×1013 cm-2 with pure AlN barrier.[Appl. Phys. Lett. 90, 182112 (2007)].For Al compositions larger than 40%, due to the large lattice mismatch between GaN and AlGaN, strain-related issues significantly reduce the mobility for these high sheet carrier densities. Recently, using nearly lattice-matched AlInN/GaN to improve the performance of HFETs has been studied
theoretically and experimentally. A high sheet density (2.42 ×1013 cm2) with >1000 cm2/Vs mobility has been reported by inserting an AlN spacer layer between the AlGaN barrier and GaN channel. However, low-temperature mobilities for AlInN/GaN HFETs are much lower than those for AlGaN/GaN HFETs. In this paper, we study the Al1-xInxN/AlN/GaN (x=0.20 - 0.12) (HFETs) grown by metalorganic chemical vapor deposition. Reduction of In composition from 20% to
12% increased the room temperature equivalent two-dimensional-electron-gas (2DEG) density from 0.90×1013 cm-2 to 1.64 ×1013 cm-2 with corresponding electron mobilities of 1600 cm2/Vs and 1410 cm2/Vs. Furthermore, at 10 K, the mobility reached 17,600 cm2/Vs with a sheet density 9.6 ×1012 cm-2 for the nearly lattice-matched Al0.82In0.18N
/AlN/GaN heterostructure. The HFETs having 1 μm gate length exhibited a maximum transconductance of ~ 250 mS/mm with good pinch-off characteristics.
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In this paper, we investigated Schottky and metal-semiconductor-metal (MSM) photodetector structures fabricated on
GaN templates with in situ SiNx nanonetwork, which were shown to reduce the dislocation densities significantly in the
overgrown material. The GaN layers were grown by metalorganic chemical vapor deposition. The peak responsivity of
the Schottky photodetectors on templates with SiNx nanonetwork was measured to be 0.16 A/W, significantly larger
than that for the control samples (0.09 A/W). The MSM photodetectors on templates with SiNx nanonetwork also
showed significantly enhanced photoresponsivity (100 A/W) when compared to the control sample without any SiNx
(30 A/W) and photoconductive gain. The improvement in the photoresponsivity in both Schottky and MSM
photodetector structures with the use of SiNx nanonetwork is due to the reduction of dislocation densities.
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Electroluminescence (EL) efficiency of a bright blue (In,Ga)N quantum-well (QW) diode has been studied in comparison with a high quality GaAs QW diode over a wide temperature range and as a function of current. For the red diode the EL intensity increases in directly proportional to the current at 20 K, indicating a nearly unity external quantum efficiency, although the EL efficiency is influenced by the transport of electrically injected carriers and nonradiative processes at higher temperatures. For the blue diode, however, the room temperature EL efficiency is surprisingly high, although the low-temperature EL efficiency is found to be quite low at high injection and significantly varied with current. These variations of the EL efficiency with current and temperature for the blue diode are attributed to the carrier capture and escape processes influenced under the internal piezo-field effects as a function of forward bias voltage.
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We reported the systematical study of optical properties of hexagonal AlxGa1-xN epitaxial films grown on c-sapphire substrate using metal-organic chemical vapor deposition. By performing Fourier transform infrared spectroscopy
measurements, the high-frequency dielectric constants and phonon frequencies can be obtained by theoretically fitting
the experimental infrared reflectance spectra using a four-phase layered model. The high-frequency dielectric constant of
AlxGa1-xN varies between 4.98 and 4.52 for ε∞⊥(polarization perpendicular to the optical axis) and between 4.95 and
4.50 for ε∞,//(polarization parallel to the optical axis) respectively when the aluminum composition changes from 0.15 to
0.24. Furthermore, from experimental infrared reflectance spectra of AlxGa1-xN films, a specific absorption dip at 785 cm-1 was observed when the aluminum composition is larger than 0.24. The dip intensity increases and the dip frequency
shifts from 785 to 812 cm-1 as aluminum composition increases from 0.24 to 0.58. According to the reciprocal space
map of x-ray diffraction measurements, the emergence of this dip could be resulted from the effects of strain relaxation
in AlGaN epitaxial layers due to the large lattice mismatch between GaN and AlGaN epitaxial film.
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A three-pair AlGaN/GaN multiple quantum well (MQW) structure with superlattices (SLs) was grown on
c-plane sapphire using metal organic chemical vapor deposition (MOCVD) system. The AlGaN barrier and GaN
well of the MQW structure were grown by atomic layer deposition (ALD) and conventional growth,
respectively. The HRTEM and HRXRD results show the grown structure has shape interface between SLs
layers and QWs with good periodicity. The AFM and SEM data show smooth surface morphology with low
RMS value and low defect density. The CL measurements also indicate uniform luminescence pattern at room
temperature. The AlGaN/GaN MQW with AlN/GaN SLs structure grown by ALD could be used to improve the
surface morphology by effectively suppress the threading dislocation.
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AlGaN/6H-SiC heterojunction bipolar transistors (HBTs) were fabricated, and the device performance as well as the
electrical properties of the n-AlGaN/p-SiC heterojunction were studied by temperature dependent current-voltage
characterization. Current gain β=IC/IB calculated from I-V characteristics varied from sample to sample in the range of
75-100. A barrier height of 1.1 eV is derived from the Arrhenius plot and its origin is discussed.
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Planar m-plane GaN was grown on
(11¯00) m-plane 6H-SiC substrates using high-temperature AlN nucleation layers by
metalorganic chemical vapor deposition. Scanning electron microscopy (SEM) and atomic force microscopy (AFM)
images showed striated features on the sample surface aligned along the GaN
[11¯20] direction, which are perpendicular
to those associated with a-plane
(11¯20) GaN. The epitaxial relationship between the m-GaN and 6H-SiC was analyzed
using high-resolution x-ray diffraction (XRD). In order to reduce the defect density, epitaxial lateral overgrowth (ELO)
was carried out on an m-GaN template with mask stripes along the GaN
[11¯20] direction, which makes the lateral
growth fronts advance along the GaN c-axis. On-axis XRD rocking curves show that the full width at half maximum
(FWHM) values for the ELO samples were reduced by nearly half when compared to those of the m-plane template
without ELO. Clear atomic steps were observed in the wing regions by AFM. The absence of the striated features that
are associated with the template could be indicative of the reduction of basal stacking faults in the ELO wings. Lowtemperature
photoluminescence (PL) spectra showed an excitonic emission at 3.47eV, a basal stacking fault (BSF)-
related emission at 3.41 eV, and other defect-related emissions at 3.29 eV and 3.34 eV.
For exact notation please see manuscript
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We have modified the anomalous peak energy of the temperature dependent photoluminescence (PL) of AlxGa1-xN/GaN
nanoheterostructures (0
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Deep levels in thin GaN epilayers grown by metal-organic chemical vapor deposition on different
templates were studied by photocapacitance spectroscopy and deep-level transient spectroscopy
(DLTS) using Schottky barrier diodes. We observed the reduction of electrically and optically active
traps in GaN grown with in situ SiNx nanonetwork and SiO2 striped mask or conventional epitaxial
lateral overgrowth technique (ELO) as compared to a typical control layer on a sapphire substrate.
All samples measured by DLTS in the temperature range from 80 K to 400 K exhibited traps with
activation energies 0.55-0.58 eV and 0.21-0.28 eV. The lowest concentration of both traps was
achieved for the sample with 6 min deposition of SiNx nanonetwork, which was lower than that for
the sample prepared by conventional ELO, and much lower than that in the control. The steady-state
photocapacitance spectra of all samples taken at 80 K over the spectral range 0.75-3.50 eV
demonstrated a similar trend for all the layers. The photocapacitance spectra exhibited defect levels
with optical threshold energies of 1.2-1.3, 1.6, 2.2 and 3.1 eV. The determined concentrations of
traps were compared and the results were consistent with DLTS measurements. The layer with SiNx
nanonetwork has the lowest concentrations of optically active traps with the standard GaN control
layer being the worst in terms of trap concentrations. The consistent trend among the
photocapacitance spectroscopy and DLTS results suggests that SiNx network can effectively reduce
deep levels in GaN, which otherwise can deteriorate both optical and electrical performance of GaN-based
devices.
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The surface morphologies of unintentionally doped epitaxial laterally overgrown c-plane and a-plane
GaN samples subjected to photoelectrochemical (PEC) etching in aqueous KOH is reported. By
maintaining the etch in the carrier-limited regime, elucidation of the optically and electrically active
defects can be achieved. Results correlating surface morphologies after PEC etching with TEM results
verify the reduction of threading dislocations in the overgrown "wing" regions, as compared with the
"windows" (seed regions) for both a- and c-plane GaN ELO samples. Also, within and near the
window regions of the a-GaN ELO samples, PEC etching reveals a significant amount of basal
stacking faults that propagate to the surface. This work represents a systematic evaluation of the effects
of PEC etching on polar and nonpolar surfaces of the GaN layers grown by the conventional ex situ
ELO method. The surface morphology and the whisker densities after PEC etching of c-plane GaN
samples grown using SiNx nanonetwork mask layers, a method referred to as in situ nano-ELO, also
indicates significant improvement of the material quality. The identification of variations in surface
morphology at different times during PEC etching of GaN may have utility in that the assessment of
the material quality can be made and assorted nanopatterns of GaN surfaces can be intentionally
achieved in a controllable, large-scale, and inexpensive manner.
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We report a comparison of various gate dielectrics including SiO2, Si3N4, ZrO2 and Pb(Zr, Ti)O3
(PZT) on AlGaN/GaN heterojunction field-effect transistors, deposited by PECVD, MBE, and
sputtering respectively. In terms of I-V characteristics, maximum drain-source current could be
enhanced under positive gate voltage and the reverse leakage current level decreases by orders of
magnitude. In terms of DC measurements, very thin SiO2 layers can improve performance, which
may be due to the passivation effect to remove surface states. No significant difference exists
between control and the Si3N4 and ZrO2 samples. Slightly reduction in transconduction is observed
on the sample with PZT probably because of the much thicker layer was utilized. The thickness of
insulator layers examined from C-V measurements reveals a better crystal quality can be obtained
by PECVD deposition. While the RF S-parameters measurements shows the PZT gate dielectric
brings the highest cut-off frequency or the lowest gate capacitance confirmed also by C-V data,
which makes it a better candidate for microwave applications.
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The polarization fields in the c-axis-oriented hexagonal GaN system cause spatial separation of electrons and holes in
quantum wells, reducing the quantum efficiency, and resulting in a red shift of the emission as well as a blue shift with
increasing injected carrier density. In this paper, we report on the growth and optical characterization of InGaN/GaN
multiple quantum wells (MQWs) on nonpolar
(112¯0) a- and polar (0001) c-planes, as well as two semipolar planes,
(112¯2) and (11¯01) of GaN. There are two kinds of a-plane used in this study. One of the (112¯0) a-planes was
obtained on
(11¯00) m-plane sapphire substrates during the epitaxial lateral overgrowth (ELO) of
(112¯2) oriented
semipolar GaN films, while the other one was planar a-plane GaN which was grown on
(11¯01) r-plane sapphire
substrates. The semipolar
(112¯2) and (11¯01) planes were obtained as sidewall facets during the ELO of c-plane GaN
with the mask stripes aligned along the GaN m-axis and a-axis, respectively. InGaN/GaN multiple quantum wells
(MQWs) with a nominal well thickness of 4 nm and a barrier thickness of 8 nm were grown on these five GaN
samples by metalorganic chemical vapor deposition. Excitation power dependent photoluminescence (PL)
measurements were carried out on these quantum well structures to study the effect of polarization-induced electric
field on the band-edge emission. The quantum-well emission energy from the two a-plane MQWs showed zero shift,
compared to a 74 meV blue shift for the c-plane MQWs when the excitation power was increased from 1.3 mW to
37.0 mW. The semipolar
(112¯2) showed a blue shift of 35 meV with increased excitation power, suggesting reduced
polarization compared to that of c-plane. No quantum-well emission could be observed for the MQWs on
(11¯01)
semipolar planes. The shift in the quantum-well emission energy was attributed to the change of the screening effect of
photon-generated carriers in the quantum wells at different excitation powers.
For exact notation please see manuscript
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In this work, we prepared an organic phosphor and investigated its thermal as well as fluorescent properties. The
experimental results reveal that lab-made organic phosphor exhibits excellent thermal stability (Decomposition
temperature (Td) = 374 °C) and good fluorescent quantum yield (Φ = 0.88). The organic phosphor was then coated onto
the blue LED chip to form a white light-emitting diode. The size of blue LED die used throughout this work was 15 mil
square and the dominated wavelength was 460 nm. For the package process, the organic phosphor was firstly mixed with
the epoxy and dipped it into the LED bowl of lead frame. Secondly, the pure epoxy resin was full-filled within the lamp
model. For the measurement of spectrum and the C.I.E. value, it was found that the near white weight proportional of the
epoxy resin A, B and the organic phosphor were 1 : 1 : 0.1.
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