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Thomas E. Murphy
LED Product Manager at Hymite GmbH
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Publications (1)
Proceedings Article | 26 September 2007 Paper
A silicon wafer packaging solution for HB-LEDs
Tom Murphy, Steen Weichel, Steven Isaacs, Jochen Kuhmann
Proceedings Volume 6797, 67970F (2007) https://doi.org/10.1117/12.753085
KEYWORDS: Light emitting diodes, Silicon, Semiconducting wafers, Metals, Packaging, Resistance, Reliability, Temperature metrology, Thermography, Thermal modeling
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