Submicron patterning on flexible substrates by reduction optical lithography

Wim J. M. de Laat; Mária Péter; François Furthner; Peter T. M. Giesen; Cheng-Qun Gui; Erwin R. Meinders

doi:10.1117/12.771947

21 March 2008 Submicron patterning on flexible substrates by reduction optical lithography

Wim J. M. de Laat, Mária Péter, François Furthner, Peter T. M. Giesen, Cheng-Qun Gui, Erwin R. Meinders

Proceedings Volume 6921, Emerging Lithographic Technologies XII; 69212F (2008) https://doi.org/10.1117/12.771947
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

In this paper we report the use of projection optical lithography to pattern micron-sized features on 100 μm thick PEN foils. A foil-on-carrier lamination process was developed to ensure a good dimensional stability during the lithographic processing and imaging of the foil. A stepper based leveling metrology was used in characterizing the surface flatness of the foil-on-carriers. A lithography process was developed to image micron and submicron patterns on foil substrates. The process window for 1-10 μm features was determined from focus and exposure energy experiments. The lithographic study indicated a reproducible and excellent imaging accuracy for patterning micron-sized features on flexible substrates. This makes the technology very suitable for the manufacturing of electronic devices with critical dimensions in the micron and submicron range. In addition, we made transistors-on-foil demonstrators with the developed foil-on-carrier lamination and imaging technology.

Citation Download Citation

Wim J. M. de Laat, Mária Péter, François Furthner, Peter T. M. Giesen, Cheng-Qun Gui, and Erwin R. Meinders "Submicron patterning on flexible substrates by reduction optical lithography", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69212F (21 March 2008); https://doi.org/10.1117/12.771947

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