Critical failure ORC: application to the 90-nm and 65-nm nodes

Jerome Belledent; Shumay Dou Shang; Yorick Trouiller; Corinne Miramond; Kyle Patterson; Olivier R. Toublan; Christophe Couderc; Frank Sundermann; Yves Fabien Rody

doi:10.1117/12.537190

28 May 2004 Critical failure ORC: application to the 90-nm and 65-nm nodes

Jerome Belledent, Shumay Dou Shang, Yorick Trouiller, Corinne Miramond, Kyle Patterson, Olivier R. Toublan, Christophe Couderc, Frank Sundermann, Yves Fabien Rody

Author Affiliations +

Proceedings Volume 5377, Optical Microlithography XVII; (2004) https://doi.org/10.1117/12.537190
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

In this paper, we present a new technique (Critical Failure ORC or CF-ORC) to check the robustness of the structures created by OPC through the process window. The full methodology is explained and tested on a full chip at the 90- nm node. Improvements compared to standard ORC/MRC techniques will be presented on complex geometries. Finally, examples of concrete failure predictions are given and compared to experimental results.

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Jerome Belledent, Shumay Dou Shang, Yorick Trouiller, Corinne Miramond, Kyle Patterson, Olivier R. Toublan, Christophe Couderc, Frank Sundermann, and Yves Fabien Rody "Critical failure ORC: application to the 90-nm and 65-nm nodes", Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); https://doi.org/10.1117/12.537190

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