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Improved algorithm for automated alignment of wafers via optimized features location

[+] Author Affiliations
Michael Parshin

Bar-Ilan University, Department of Mathematics, 52900 Ramat-Gan, Israel

Zeev Zalevsky

Bar-Ilan University, School of Engineering, 52900 Ramat-Gan, Israel

J. Electron. Imaging. 18(4), 043001 (October 08, 2009). doi:10.1117/1.3243882
History: Received August 27, 2008; Revised July 30, 2009; Accepted August 17, 2009; Published October 08, 2009
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We present a new fuzzy logic–based approach for automatic optimized features location. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronics industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features location and grading supported the industrial requirements and could replace human expert–based inspection that currently is performed manually.

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Citation

Michael Parshin and Zeev Zalevsky
"Improved algorithm for automated alignment of wafers via optimized features location", J. Electron. Imaging. 18(4), 043001 (October 08, 2009). ; http://dx.doi.org/10.1117/1.3243882


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